Heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids

ABSTRACT

The present invention relates to the thermal conductive fluids in temperature difference reversely transported by the first fluid piping and second fluid piping in parallel or quasi-parallel arrangement on the same end side to produce heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving article or space thereby forming a more uniform temperature distribution status on the heat absorbing or dissipating body ( 100 ) or the passively heat dissipation or absorption receiving article or space ( 200 ).

CROSS REFERENCE TO RELATED APPLICATION

This is a continuation-in part of application Ser. No. 12/285,862, filedon Oct. 15, 2008.

BACKGROUND OF THE INVENTION

(a) Field of the Invention

The present invention discloses a device by using multi-pipe to pass thethermal conductive fluids in reverse directions as the heat absorbing ordissipating body, more specifically it is disposed with at least onepassage of the first fluid piping and at least one passage of the secondfluid piping in parallel or quasi-parallel arrangement, wherein thefirst fluid piping and the second fluid piping is arranged fortransporting the thermal conductive fluids constituted by gaseous orliquid state fluid, gaseous to liquid state fluid or liquid to gaseousstate fluid in temperature difference to the passively heat dissipationor absorption receiving article or space in mutually reverse directions,so as to produce heat absorbing or dissipating function onto thepassively heat dissipation or absorption receiving article or spacethereby forming a more uniform temperature distribution status on thepassively heat dissipation or absorption receiving article or space.

(b) Description of the Prior Art

For the conventional heat absorbing or dissipating devices by passingthrough thermal conductive fluid as the heat absorbing or dissipatingbody constituted by gaseous or liquid state fluid, gaseous to liquidstate fluid, or liquid to gaseous state fluid such as engine coolingwater radiators, heat absorbing cooling energy discharge devicesutilizing thermal conductive fluid, or heat dissipating warming energydischarge devices such as warming devices, heaters, or the warmingenergy transfer device, etc., as the flow direction of the thermalconductive fluid is fixed, larger temperature difference is formed ateach position on the heat absorbing or dissipating body of the thermalconductive fluid.

SUMMARY OF THE INVENTION

The present invention discloses that the conventional application deviceusing thermal conductive fluid in fixed flow direction as the heatabsorbing or dissipating body for heat absorption or dissipation isimproved to be constituted by a first fluid piping and a second fluidpiping in parallel or quasi-parallel arrangement, wherein the firstfluid piping and the second fluid piping is arranged for transportingthe thermal conductive fluids constituted by gaseous or liquid statefluid, gaseous to liquid state fluid or liquid to gaseous state fluid intemperature difference to the passively heat dissipation or absorptionreceiving article or space in mutually reverse directions thereby whentransporting thermal conductive fluids to perform heat absorbing ordissipating function the passively heat dissipation or absorptionreceiving article or space can form a more uniform temperaturedistribution.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a main structural schematic view of a heat absorbing ordissipating device for being passed through by thermal conductive fluidat fixed flow direction being constituted by conventional heat absorbingor dissipating gaseous or liquid state fluid or gaseous to liquid statefluid, or liquid to gaseous state fluid, etc.

FIG. 2 is a temperature difference distribution diagram of FIG. 1 beingoperated for the heat absorbing cooling energy discharge devicefunction.

FIG. 3 is a temperature difference distribution diagram of FIG. 1 beingoperated for the heat dissipating warming energy discharge devicefunction.

FIG. 4 is a main structural schematic view of the heat absorbing ordissipating device with multi-pipe reversely transported temperaturedifference fluids of the present invention.

FIG. 5 is a temperature difference distribution diagram formed on thestructure shown in FIG. 4 being operated for heat absorbing coolingenergy discharge device function.

FIG. 6 is a temperature difference distribution diagram formed on thestructure shown in FIG. 4 being operated for heat dissipating warmingenergy discharge device function.

FIG. 7 is a main structural schematic view of the structure shown inFIG. 4 showing that the first fluid piping and the second fluid pipingfor directly reversely transporting thermal conductive fluids intemperature difference by multi-pipe directly constitute the commonstructural body and directly transfer thermal energy onto the passivelyheat dissipation or absorption receiving article or space.

FIG. 8 is a temperature difference distribution diagram formed on thestructure shown in FIG. 7 being operated for heat absorbing coolingenergy discharge device function.

FIG. 9 is a temperature difference distribution diagram formed on thestructure shown in FIG. 7 being operated for heat dissipating warmingenergy discharge device function.

FIG. 10 is an embodiment schematic view of the structure shown in FIG. 4showing that the fluid inlets and the fluid outlets of the first fluidpiping and the second fluid piping for reversely transporting thermalconductive fluids in temperature difference by multi-pipe are installedat two sides of the piping respectively.

FIG. 11 is a schematic view of the embodiment shown in FIG. 4 showingthat heat absorbing or dissipating body (100) combines with thermalconductive fluid passed and passively receiving heat absorbing ordissipating tubular structure body (100′).

FIG. 12 is a schematic view of the embodiment shown in FIG. 4 showingthat the heat absorbing or dissipating body (100) combines with a numberof the thermal conductive fluid passed and passively receiving heatabsorbing or dissipating tubular structure body (100′).

FIG. 13 is a schematic view of the embodiment shown in FIG. 10 showingthat the heat absorbing or dissipating body (100) combines with thethermal conductive fluid passed and passively receiving heat absorbingor dissipating tubular structure body (100′).

FIG. 14 is a schematic view of the embodiment shown in FIG. 10 showingthat the heat absorbing or dissipating body (100) combines with a numberof the thermal conductive fluid passed and passively receiving heatabsorbing or dissipating tubular structure body (100′).

FIG. 15 is a structural schematic view of an embodiment, wherein themultiple pipes of the first fluid piping (101) and the second fluidpiping (102), which are countercurrent to each other, are sequentiallystaggered for parallel reversely transmitting thermal conductive fluid(110), according to the present invention.

FIG. 16 is a structural schematic view of an embodiment, wherein thefirst fluid piping (101) and/or the second fluid piping (102) areadditionally installed with independent thermal conductive plates,according to the present invention.

FIG. 17 is a sectional drawing of line A-A in FIG. 16.

FIG. 18 is a structural schematic view of an embodiment, wherein acommon thermal conductive plate is additionally installed between theneighboring fluid piping and the first fluid piping and/or the secondfluid piping, according to the present invention.

FIG. 19 is a sectional drawing of line B-B in FIG. 18.

FIG. 20 is a structural schematic view of an embodiment, wherein athermal conductive plate with temperature insulating slots isadditionally installed between the neighboring fluid piping and thefirst fluid piping and/or the second fluid piping, according to thepresent invention.

FIG. 21 is a sectional drawing of line C-C in FIG. 20.

FIG. 22 is a structural schematic view of the embodiment shown in FIG.15 showing that the first fluid piping and/or the second fluid pipingare additionally installed with independent thermal conductive plates.

FIG. 23 is a sectional drawing of line A-A in FIG. 22.

FIG. 24 is a structural schematic view of the embodiment shown in FIG.15 showing that a common thermal conductive plate is additionallyinstalled between the neighboring fluid piping and the first fluidpiping and/or the second fluid piping.

FIG. 25 is a sectional drawing of line B-B in FIG. 24.

FIG. 26 is a structural schematic view of the embodiment shown in FIG.15 showing that a thermal conductive plate with temperature insulatingslots is additionally installed between the neighboring fluid piping andthe first fluid piping and/or the second fluid piping.

FIG. 27 is a sectional drawing of line C-C in FIG. 26.

FIG. 28 is a block diagram of a periodic forward/reverse pumping system,according to the present invention.

DESCRIPTION OF MAIN COMPONENT SYMBOLS

-   100: Heat absorbing or dissipating body-   100′: Thermal conductive fluid passed and passively receiving heat    absorbing or dissipating tubular structure body-   101: First fluid piping-   102: Second fluid piping-   110: Thermal conductive fluid-   111: First fluid inlet-   112: First fluid outlet-   121: Second fluid inlet-   122: Second fluid outlet-   200: Passively heat dissipation or absorption receiving article in    solid, or colloid, or liquid, or gaseous state or space-   300: Independent thermal conductive plate-   350: Thermal conductive plate with temperature insulating slots-   400: Common thermal conductive plate-   500: Control device-   600: Two-way movement of fluid pumping device

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is a main structural schematic view of a heat absorbing ordissipating device for being passed through by thermal conductive fluidsat fixed flow direction being constituted by conventional heat absorbingor dissipating gaseous or liquid state fluid or gaseous to liquid statefluid, or liquid to gaseous state fluid, etc., wherein the thermalconductive fluid (110) constituted by gaseous or liquid state fluid, orgaseous to liquid state fluid, or liquid to gaseous state fluid, etcconventionally is passed through the first fluid piping (101) to combinewith the heat absorbing or dissipating assembly constituted by the heatabsorbing or dissipating body (100) for 1) passing through the thermalconductive fluid (110) in the first fluid piping (101) to performcooling or heating functions through the heat absorbing or dissipatingbody (100) onto the passively heat dissipation or absorption receivingsolid, or colloid, or liquid, or gaseous state article or space (200);or 2) passing through the thermal conductive fluid (110) in the firstfluid piping (101) to reversely receive the surrounding cooling orheating energy of the heat absorbing or dissipating body (100); theitem 1) is often applied in engine cooling water radiators, heatabsorbing cooling energy discharge devices utilizing thermal conductivefluid (110), or heat dissipating warming energy discharge devices suchas warming devices, heaters, evaporators, condensers, or the cooling orwarming energy transfer device, etc. wherein the latter item 2) is oftenapplied in cooling or warming energy transfer devices; in the item 1)application, thermal conductive fluid (110) is inputting via the inletof first fluid piping (101) at one side end of the heat absorbing ordissipating body (100) and outputting via another side end therebyforming a larger temperature difference between the inlet and outlet ofthe thermal conductive fluids (110) of the first fluid piping (101) ofthe heat absorbing or dissipating body (100), and similarly in the item2) application, it will form a larger temperature difference between theinlet and outlet of the thermal conductive fluids (110) of the firstfluid piping (101) of the heat absorbing or dissipating body (100),which are the defects of the conventional heat absorbing or dissipatingdevice.

FIG. 2 is a temperature difference distribution diagram of FIG. 1 beingoperated for the heat absorbing cooling energy discharge devicefunction; FIG. 2 shows that the thermal conductive fluid (110) in fixedflow direction as shown in FIG. 1 being operated in the conventionalheat dissipating warming energy discharge functions appears inunidirectional flow path distribution, wherein when the thermalconductive fluid (110) passes through the first fluid piping (101) alarger temperature difference distribution status forms between theinlet and outlet of the thermal conductive fluids (110) of the heatabsorbing or dissipating body (100).

FIG. 3 is a temperature difference distribution diagram of FIG. 1 beingoperated for the heat dissipating warming energy discharge devicefunction, wherein FIG. 3 shows that the thermal conductive fluid (110)in fixed flow direction as shown in FIG. 1 being operated in theconventional heat absorbing cooling energy discharge function appears inunidirectional flow path distribution, wherein when the thermalconductive fluid (110) passes through the first fluid piping (101) alarger temperature difference distribution status forms between theinlet and outlet of the thermal conductive fluid (110) of the heatabsorbing or dissipating body (100).

Aiming to above the phenomenon, the present invention innovativelydiscloses a device by passing thermal conductive fluids for heatabsorption or dissipation which uses a method by respectively pumpingthe multi-pipe temperature difference fluids in reverse directions toproduce heat absorbing or dissipating function onto the passively heatdissipation or absorption receiving article or space thereby allowingthe heat absorbing or dissipating thermal conductive fluid to appear themore uniform temperature distribution status.

FIG. 4 is a main structural schematic view of the heat absorbing ordissipating device with multi-pipe reversely transported temperaturedifference fluids of the present invention, wherein the assemblystructure of the heat absorbing or dissipating device with multi-pipereversely transported temperature difference fluids mainly comprises thefollowing:

Heat absorbing or dissipating body (100): made of thermal conductivematerial in solid, or colloid, or liquid, or gaseous state for receivingthe thermal energy of the thermal conductive fluid (110) constituted bygaseous or liquid state fluid, gaseous to liquid state fluid, or liquidto gaseous state fluid inside the combined first fluid piping (101) andthe second fluid piping (102) so as to perform heat absorbing coolingenergy discharge operating function or heat dissipating warming energydischarge operating function onto the passively heat dissipation orabsorption receiving solid, or colloid, or liquid, or gaseous statearticle or space (200), wherein the number of the heat absorbing ordissipating bodies (100) can be one or more than one;

First fluid piping (101), Second fluid piping (102): made of goodthermal conductive material for reversely passing the thermal conductivefluid (110) constituted by gaseous or liquid state liquid, gaseous toliquid state fluid, or liquid to gaseous state fluid for transferringthermal energy to the heat absorbing or dissipating body (100) made ofgood thermal conductive material in solid, or colloid, or liquid, orgaseous state, wherein the first fluid piping (101) and the second fluidpiping (102) can be respectively constituted by one or more than onepassage;

The first fluid inlet (111) of the first fluid piping (101) is parallelconnected with the second fluid inlet (121) of the second fluid piping(102) to receive the inflow of the thermal conductive fluid (110) andthe first fluid outlet (112) of the first fluid piping (101) is parallelconnected with the second fluid outlet (122) of the second fluid piping(102) to receive the outflow of the thermal conductive fluid (110);

The first fluid piping (101) and the second fluid piping (102) areparallel or quasi-parallel distributed in a plane structure orthree-dimensional structure in the heat absorbing or dissipating body(100), and it is characterized by that the first fluid inlet (111) andthe second fluid outlet (122) are installed at the location adjacent tothe heat absorbing or dissipating body (100), while the first fluidoutlet (112) and the second fluid inlet (121) are installed on anotherlocation adjacent to the heat absorbing or dissipating body (100)thereby the thermal conductive fluids (110) in two circuits inside thefirst fluid piping (101) and the second fluid piping (102) beinginstalled on the heat absorbing or dissipating body (100) arerespectively transported in reverse directions to commonly allow thewhole temperature difference of the heat absorbing or dissipating body(100) more uniformly distributed for performing heat absorbing ordissipating function onto the passively heat dissipation or absorptionreceiving solid, or colloid, or liquid, or gaseous state article orspace (200).

The structural relationships between the heat absorbing or dissipatingbody (100), the first fluid piping (101), and the second fluid piping(102) as shown in FIG. 4 can be constituted by one or more than onerelationships as following, include:

(1) The heat absorbing or dissipating body (100) is in a assembledstructure with at least one of the first fluid piping (101) and thesecond fluid piping (102);

(2) The heat absorbing or dissipating body (100) is in an integralstructure with at least one of the first fluid piping (101) and thesecond fluid piping (102);

(3) The function of the heat absorbing or dissipating body (100) isdirectly provided by at least one of the first fluid piping (101) andthe second fluid piping (102);

(4) The first fluid piping (101) and/or the second fluid piping (102) isadditionally installed with independent thermal conductive plate (300)which does not connect with the neighboring fluid piping;

(5) Common thermal conductive plate (400) connects between theneighboring fluid piping and the first fluid piping (101) and/or thesecond fluid piping (102); and

(6) Thermal conductive plate with temperature insulating slots connectsbetween the neighboring fluid piping and the first fluid piping (101)and/or the second fluid piping (102).

FIG. 5 is a temperature difference distribution diagram of the structureshown in FIG. 4 being operated for heat absorbing cooling energydischarge device function; as shown in FIG. 5, in the heat absorbing ordissipating body (100) constituted by solid, or colloid, or liquid, orgaseous state thermal conductive material as shown in the structure ofFIG. 4, the first fluid inlet (111) of the first fluid piping (101) andthe second fluid outlet (122) of the second fluid piping (102) areinstalled in adjacency, while the first fluid outlet (112) of the firstfluid piping (101) and the second fluid inlet (121) of the second fluidpiping (102) are installed in adjacency at another location forrespectively transporting the two circuits of the thermal conductivefluid flows (110) in reverse directions, wherein the input flow of thethermal conductive fluid (110) appears at lower temperature status,while the output flow of the thermal conductive fluid (110) appears athigher temperature status, and the heat absorbing or dissipating body(100) appears at an intermediate temperature between the ones of inputand output flows of the thermal conductive fluid (110) and appears moreuniformly distributed along the heat absorbing or dissipating body (100)for performing heat absorbing and cooling energy discharge onto thepassively heat dissipation or absorption receiving article in solid, orcolloid, or liquid, or gaseous state or space (200) thereby avoidinglocalized over-low temperatures.

FIG. 6 is a temperature difference distribution diagram of the structureshown in FIG. 4 being operated for heat dissipating warming energydischarge device function; as shown in FIG. 6, in the heat absorbing ordissipating body (100) constituted by solid, or colloid, or liquid, orgaseous state thermal conductive material as shown in the structure ofFIG. 4, the first fluid inlet (111) of the first fluid piping (101) andthe second fluid outlet (122) of the second fluid piping (102) areinstalled in adjacency, while the first fluid outlet (112) of the firstfluid piping (101) and the second fluid inlet (121) of the second fluidpiping (102) are installed in adjacency at another location forrespectively transporting the two circuits of the thermal conductivefluid flows (110) in reverse directions, wherein the input flow of thethermal conductive fluid (110) appears at higher temperature status,while the output flow of the thermal conductive fluid (110) appears atlower temperature status, and the heat absorbing or dissipating body(100) appears at an intermediate temperature between the ones of inputand output flows of the thermal conductive fluid (110) and appears moreuniformly distributed along the heat absorbing or dissipating body (100)for performing heat dissipating and warming energy discharge onto thepassively heat dissipation or absorption receiving article in solid, orcolloid, or liquid, or gaseous state or space (200) thereby avoidingover-high temperatures.

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids, beside of transferringthermal energy via the heat absorbing or dissipating body (100), thefirst fluid piping (101) and the second fluid piping (102) can beparallel or quasi-parallel distributed in a plane structure orthree-dimensional structure to directly constitute structural body,thereby the first fluid piping (101) and the second fluid piping (102)is arranged to directly reversely transport the thermal conductive fluid(110) constituted by gaseous or liquid state fluid, gaseous to liquidstate fluid, or liquid to gaseous state fluid in temperature differencefrom the same end side thereby allowing the first fluid piping (101) andthe second fluid piping (102) to directly perform heat dissipatingwarming energy discharge or heat absorbing cooling energy discharge onthe passively heat dissipating or absorption receiving article or space.

FIG. 7 is a main structural schematic view of the structure shown inFIG. 4 showing that the first fluid piping and the second fluid pipingfor directly reversely transporting thermal conductive fluids intemperature difference by multi-pipe directly constitute the commonstructural body and directly transfer thermal energy onto the passivelyheat dissipation or absorption receiving article or space; wherein thestructure of FIG. 7 is further constituted, including:

First fluid piping (101), Second fluid piping (102): made of goodthermal conductive material to constitute the common structural body fortransferring thermal energy through the thermal conductive fluid (110)constituted by gaseous or liquid state liquid, gaseous to liquid statefluid, or liquid to gaseous state fluid to the passively heatdissipation or absorption receiving article in solid, or colloid, orliquid, or gaseous state or space (200), wherein the first fluid piping(101) and the second fluid piping (102) can be respectively constitutedby one or more than one circuits; the first fluid inlet (111) of thefirst fluid piping (101) is parallel connected with the second fluidinlet (121) of the second fluid piping (102) to receive inflow of thethermal conductive fluid (110), and the first fluid outlet (112) of thefirst fluid piping (101) is parallel connected with the second fluidoutlet (122) of the second fluid piping (102) to receive outflow of thethermal conductive fluid (110), while the first fluid piping (101) andthe second fluid piping (102) the first fluid piping (101) and thesecond fluid piping (102) appear in parallel or quasi-paralleldistributed in a plane structure or three-dimensional structure toconstitute the common structural body, wherein it is characterized bythat the first fluid inlet (111) of the first fluid piping (101) and thesecond fluid outlet (122) of the second fluid piping (102) are installedat the location adjacent to their common structural body, while thefirst fluid outlet (112) of the first fluid piping (101) and the secondfluid inlet (121) of the second fluid piping (102) are installed on theanother location adjacent to their common structural body, thereby forthe first fluid piping (101) and the second fluid piping (102) in themultiple pipes of the common structural body to transport two circuitsof the thermal conductive fluid flows (110) respectively in reversedirections thereby making the whole temperature difference of theircommon structural body more uniformly distributed in the passively heatdissipation or absorption receiving article in solid, or colloid, orliquid, or gaseous state or space (200) to perform heat absorption ordissipation onto the passively heat dissipation or absorption receivingarticle in solid, or colloid, or liquid, or gaseous state or space(200).

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids of the present invention, thestructural relationships between the passively heat dissipation orabsorption receiving article in solid, or colloid, or liquid, or gaseousstate or space (200), the first fluid piping (101) and the second fluidpiping (102) include the following: the function of the heat absorbingor dissipating body (100) is directly provided by at least one of thefirst fluid piping (101) and the second fluid piping (102) to performheat absorption or dissipation onto the passively heat dissipation orabsorption receiving article in solid, or colloid, or liquid, or gaseousstate or space (200), or to further use the first fluid piping and thesecond fluid piping that using multi-pipe to reversely transport thermalconductive fluids to directly constitute the common structural body andto directly transfer thermal energy onto the passively heat dissipationor absorption receiving article in solid, or colloid, or liquid, orgaseous state or space (200).

FIG. 8 is a temperature difference distribution diagram of the structureshown in FIG. 7 being operated for heat absorbing cooling energydischarge device function; as shown in FIG. 8, in the common structuralbody as shown in the structure of FIG. 7, the first fluid inlet (111) ofthe first fluid piping (101) and the second fluid outlet (122) of thesecond fluid piping (102) are installed in adjacency, while the firstfluid outlet (112) of the first fluid piping (101) and the second fluidinlet (121) of the second fluid piping (102) are installed in adjacencyat another location for respectively transporting the two circuits ofthe thermal conductive fluid flows (110) in reverse directions, whereinthe input flow of the thermal conductive fluid (110) appears at lowertemperature status, while the output flow of the thermal conductivefluid (110) appears at higher temperature status, and the commonstructural body appears at an intermediate temperature between the onesof input and output flows of thermal conductive fluids (110) and appearsmore uniformly distributed in the passively heat dissipation orabsorption receiving article in solid, or colloid, or liquid, or gaseousstate or space (200) to perform heat absorbing and cooling energydischarge onto the passively heat dissipation or absorption receivingarticle in solid, or colloid, or liquid, or gaseous state or space (200)thereby avoiding localized over-low temperatures.

FIG. 9 is a temperature difference distribution diagram of the structureshown in FIG. 7 being operated for heat dissipating warming energydischarge device function; as shown in FIG. 9, in the common structuralbody as shown in the structure of FIG. 7, the first fluid inlet (111) ofthe first fluid piping (101) and the second fluid outlet (122) of thesecond fluid piping (102) are installed in adjacency, while the firstfluid outlet (112) of the first fluid piping (101) and the second fluidinlet (121) of the second fluid piping (102) are installed in adjacencyat another location for respectively transporting the two circuits ofthe thermal conductive fluid flows (110) in reverse directions, whereinthe input flow of the thermal conductive fluid (110) appears at highertemperature status, while the output flow of the thermal conductivefluid (110) appears at lower temperature status, and the commonstructural body appears at an intermediate temperature between the onesof input and output flows of thermal conductive fluids (110) and appearsmore uniformly distributed in the passively heat dissipation orabsorption receiving article in solid, or colloid, or liquid, or gaseousstate or space (200) to perform heat dissipating and warming energydischarge onto the passively heat dissipation or absorption receivingarticle in solid, or colloid, or liquid, or gaseous state or space (200)thereby avoiding localized over-high temperatures.

The heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids further can be installed withthe fluid inlets and the fluid outlets of the first fluid piping and thesecond fluid piping for reversely transporting thermal conductive fluidsin temperature difference by multi-pipe at two sides of the piping, withsame height or different height, respectively.

FIG. 10 is an embodiment schematic view of the structure shown in FIG. 4showing that the fluid inlets and the fluid outlets of the first fluidpiping and the second fluid piping for reversely transporting thermalconductive fluids in temperature difference by multi-pipe are installedat two sides of the piping respectively.

The heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids further can be installed withthermal conductive fluid passed and passively receiving heat absorbingor dissipating tubular structure body (100′), which is composed of oneor more fluid piping or the structure similar the heat absorbing ordissipating body (100), in place of the passively heat dissipation orabsorption receiving article in solid, or colloid, or liquid, or gaseousstate or space (200).

FIG. 11 is a schematic view of the embodiment shown in FIG. 4 showingthat the heat absorbing or dissipating body (100) combines with thethermal conductive fluid passed and passively receiving heat absorbingor dissipating tubular structure body (100′).

FIG. 12 is a schematic view of the embodiment shown in FIG. 4 showingthat the heat absorbing or dissipating body (100) combines with a numberof the thermal conductive fluid passed and passively receiving heatabsorbing or dissipating tubular structure body (100′).

FIG. 13 is a schematic view of the embodiment shown in FIG. 10 showingthat the heat absorbing or dissipating body (100) combines with thethermal conductive fluid passed and passively receiving heat absorbingor dissipating tubular structure body (100′).

FIG. 14 is a schematic view of the embodiment shown in FIG. 10 showingthat the heat absorbing or dissipating body (100) combines with a numberof the thermal conductive fluid passed and passively receiving heatabsorbing or dissipating tubular structure body (100′).

The heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids also can be formed by themultiple pipes of the first fluid piping (101) and the second fluidpiping (102), which are countercurrent to each other, sequentiallystaggered for parallel reversely transmitting the thermal conductivefluid (110).

FIG. 15 is a structural schematic view of an embodiment, wherein themultiple pipes of the first fluid piping (101) and the second fluidpiping (102), which are countercurrent to each other, are sequentiallystaggered for parallel reversely transmitting the thermal conductivefluid (110).

As shown in FIG. 15, by the multiple pipes of the first fluid piping(101) and the second fluid piping (102), which are countercurrent toeach other, being sequentially staggered for forming the heat absorbingor dissipating body (100), when the thermal conductive fluid (110)passes through the first fluid piping (101) with forward current and thesecond fluid piping (102) with reverse current, which are sequentiallystaggered, more uniform temperature distribution will be produced at twosides of the heat absorbing or dissipating body (100); the above firstfluid piping (101) and/or second fluid piping (102) are straight pipeseach with single segment or curved pipes each with at least one bending,and every bending segment of the first fluid piping (101) and the secondfluid piping (102) are staggered in the order of mutual countercurrent.

The piping in the heat absorbing or dissipating device with multi-pipereversely transported temperature difference fluids can be additionallyinstalled with an independent thermal conductive plate (300), and/or acommon thermal conductive plate (400), and/or a thermal conductive plate(350) with temperature insulating slots to improve effects of heatabsorption or dissipation, wherein:

for further improving effects of heat absorption or dissipation, thefirst fluid piping (101) and/or the second fluid piping (102) can beadditionally installed with an independent thermal conductive plate toincrease heat absorption or dissipation area to improve effects of heatabsorption or dissipation.

FIG. 16 is a structural schematic view of an embodiment, wherein thefirst fluid piping (101) and/or the second fluid piping (102) areadditionally installed with independent thermal conductive plates,according to the present invention.

FIG. 17 is a sectional drawing of line A-A in FIG. 16.

For further increasing heat absorption or dissipation area and enhancingstructure stability, common thermal conductive plate (400) isadditionally installed between the neighboring fluid piping and thefirst fluid piping (101) and/or the second fluid piping (102) to improveeffects of heat absorption or dissipation.

FIG. 18 is a structural schematic view of an embodiment, wherein acommon thermal conductive plate is additionally installed between theneighboring fluid piping and the first fluid piping and/or the secondfluid piping, according to the present invention.

FIG. 19 is a sectional drawing of line B-B in FIG. 18.

For increasing heat absorption or dissipation area and enhancingstructure stability, thermal conductive plate (350) with temperatureinsulating slots further can be additionally installed between theneighboring fluid piping and the first fluid piping (101) and/or thesecond fluid piping (102) to improve effects of heat absorption ordissipation.

FIG. 20 is a structural schematic view of an embodiment, wherein athermal conductive plate with temperature insulating slots isadditionally installed between the neighboring fluid piping and thefirst fluid piping and/or the second fluid piping, according to thepresent invention.

FIG. 21 is a sectional drawing of line C-C in FIG. 20.

As the embodiment of the heat absorbing or dissipating device withmulti-pipe reversely transported temperature difference fluids shown inFIG. 15, by the multiple pipes of the first fluid piping (101) and thesecond fluid piping (102) being sequentially staggered for forming theheat absorbing or dissipating body (100), when the thermal conductivefluid (110) passes through the first fluid piping (101) and the secondfluid piping (102), which are sequentially staggered, more uniformtemperature distribution will be produced at two sides of the heatabsorbing or dissipating body (100); for further improving effects ofheat absorption or dissipation, the first fluid piping (101) and/or thesecond fluid piping (102) can be additionally installed with theindependent thermal conductive plate (300) to increase heat absorptionor dissipation area to improve effects of heat absorption ordissipation.

FIG. 22 is a structural schematic view of the embodiment shown in FIG.15 showing that the first fluid piping and/or the second fluid pipingare additionally installed with independent thermal conductive plates.

FIG. 23 is a sectional drawing of line A-A in FIG. 22.

As the embodiment of the heat absorbing or dissipating device withmulti-pipe reversely transported temperature difference fluids shown inFIG. 15, for further improving effects of heat absorption ordissipation, the common thermal conductive plate (400) is additionallyinstalled between the neighboring fluid piping and the first fluidpiping (101) and/or the second fluid piping (102) to improve effects ofincreasing heat absorption or dissipation area and enhancing structurestability.

FIG. 24 is a structural schematic view of the embodiment shown in FIG.15 showing that a common thermal conductive plate is additionallyinstalled between the neighboring fluid piping and the first fluidpiping and/or the second fluid piping.

FIG. 25 is a sectional drawing of line B-B in FIG. 24.

As the embodiment of the heat absorbing or dissipating device withmulti-pipe reversely transported temperature difference fluids shown inFIG. 15, in order to give consideration to structure stability, process,and the need for functionality of independent temperature guiding, thethermal conductive plate (350) with temperature insulating slots furthercan be additionally installed between the neighboring fluid piping andthe first fluid piping (101) and/or the second fluid piping (102) toincrease heat absorption or dissipation area and enhance structurestability.

FIG. 26 is a structural schematic view of the embodiment shown in FIG.15 showing that a thermal conductive plate with temperature insulatingslots is additionally installed between the neighboring fluid piping andthe first fluid piping and/or the second fluid piping.

FIG. 27 is a sectional drawing of line C-C in FIG. 26.

As the embodiment of the heat absorbing or dissipating device withmulti-pipe reversely transported temperature difference fluids, thefluid passing through the first fluid piping (101) and/or the thermalconductive fluid passed and passively receiving heat absorbing ordissipating tubular structure body (100′) can be controlled by controldevice (500) to drive two-way movement of fluid pumping device (600) forperiodic forward/reverse pumping operation, to periodicallyforward/reverse pump the thermal conductive fluid (110), and to improveeffects of uniform temperature.

The above two-way movement of fluid pumping device (600) is used forperiodic forward/reverse pumping under the control of control devicecomposed of electromechanical device, electronic device, ormicrocomputer and related software.

FIG. 28 is a block diagram of a periodic forward/reverse pumping system,according to the present invention.

For applications of the heat absorbing or dissipating device withmulti-pipe reversely transported temperature difference fluids, one ormore than one methods based afore the operating principles according toapplication structural needs and cost considerations can be used to makethe following designs, including:

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids, the first fluid piping (101)and the second fluid piping (102) can be constituted by an integral typestructure of the piping made directly using the structure of the heatabsorbing or dissipating body (100);

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids, the three of first fluidpiping (101), second fluid piping (102) and heat absorbing ordissipating body (100) can be constituted by an assembled structure;

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids, the heat absorbing ordissipating body (100) for combination with the first fluid piping (101)and the second fluid piping (102) can be constituted by the structuralunit of the single structural body in plate, block, or multi-fins shape,or the structural unit assembled by fins, and can be constituted by atleast one structural unit;

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids, the three of the heatabsorbing or dissipating body (100) constituted by solid, or colloid, orliquid, or gaseous state thermal conductive material, the first fluidpiping (101) and the second fluid piping (102) can be partly or all madeto various geometric shapes while without changing the principles;

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids, the thermal conductive fluid(110) passing through the first fluid piping (101) and the second fluidpiping (102) can be transported by pumping, evaporation, or heat-coldnatural circulation;

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids, the warming or cooling energyis discharged to the liquid state passively heat dissipation orabsorption receiving article or space (200) through using the cold-heatnatural circulation of fluid in temperature difference or forced fluidpumping to generate thermal transfer function of heat convention,radiation or conduction; or the warming or cooling energy is dischargedto the solid or colloidal or liquid or gaseous state passively heatdissipation or absorption receiving article or space (200) throughconduction;

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids, the thermal conductive fluid(110) passing through the first fluid piping (101) and the second fluidpiping (102) is closed-loop circulated or open-loop released;

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids, the fluid inlets and thefluid outlets of the various fluid piping can be installed with same ordifferent pointing direction within three-dimensional space; and

For the heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids, there are variousinstallation modes of the fluid piping, including that the fluid pipingis composed of tubular structure; and/or the fluid piping is composed ofplate sheet structure for fluid flow; and/or the pore-like fluid pipingis composed of blocky structure for fluid flow.

The heat absorbing or dissipating device with multi-pipe reverselytransported temperature difference fluids of the present invention canbe applied for various heat absorbing, or dissipating, or cooling heatconducting application devices, such as the cooling water radiators ofthe engine, heat absorbing cooling energy discharge device using thermalconductive fluid, or heat dissipating warming energy discharge deviceusing thermal conductive fluid such as thermal energy, heater or thermalenergy transfer devices for warming equipments, or heating or coolingfor ceilings, walls or floors of the buildings, or cooling ofphotovoltaic panels, or heating or cooling for electrical machine orpower machineries, or heat absorption and dissipation of various machinecasings, heat pipe structures, structure casings, various chips orsemiconductor components, ventilation devices, or the heat absorption,heat dissipation or thermal energy transfer of information, audio orimage devices, or heat dissipation of various lamp or LED devices, orthe heat absorption of the evaporator or heat dissipation or thermalenergy transfer of condensers of air conditioning devices, or thermalenergy transfer of mechanical devices, or heat dissipation of frictionalheat loss, or heat dissipation or thermal energy transfer of electricheater or other electric heating home appliances or cooking devices, orheat absorption or thermal energy transfer of flame heating stoves orcooking devices, or heat absorption, heat dissipation or thermal energytransfer of earth layer or water thermal energy, plant or housingbuilding or building material or building structure devices, heatabsorbing or dissipation of water tower, or heat absorption, heatdissipation or thermal energy transfer of batteries of fuel cells, etc.;

As well as applied for thermal energy transfer in home appliances,industrial products, electronic products, electrical machines ormechanical devices, power generation equipments, buildings, airconditioning devices, industrial equipments or industrial manufacturingprocess.

1. A heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids, which is a device by passing thermal conductive fluids as heat absorbing or dissipating body, wherein the multiple pipes reversely transport the temperature difference fluids respectively, so as to produce heat absorbing or dissipating function onto passively heat dissipation or absorption receiving article or space thereby the thermal conductive fluids form a more uniform temperature distribution status on the heat absorbing or dissipating body, the main components including: Heat absorbing or dissipating body (100): made of thermal conductive material in solid, or colloid, or liquid, or gaseous state for receiving the thermal energy of the thermal conductive fluid (110) constituted by gaseous or liquid state fluid, gaseous to liquid state fluid, or liquid to gaseous state fluid inside the combined first fluid piping (101) and the second fluid piping (102) so as to perform heat absorbing cooling energy discharge operating function or heat dissipating warming energy discharge operating function onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200), wherein the number of the heat absorbing or dissipating bodies (100) is one or more than one; and First fluid piping (101), Second fluid piping (102): made of good thermal conductive material for reversely passing the thermal conductive fluid (110) constituted by gaseous or liquid state liquid, gaseous to liquid state fluid, or liquid to gaseous state fluid for transferring thermal energy to the heat absorbing or dissipating body (100) made of good thermal conductive material in solid, or colloid, or liquid, or gaseous state, wherein the first fluid piping (101) and the second fluid piping (102) are respectively constituted by one or more than one passage; and wherein the first fluid inlet (111) of the first fluid piping (101) is parallel connected with the second fluid inlet (121) of the second fluid piping (102) to receive the inflow of the thermal conductive fluid (110) and the first fluid outlet (112) of the first fluid piping (101) is parallel connected with the second fluid outlet (122) of the second fluid piping (102) to receive the outflow of the thermal conductive fluid (110); and the first fluid piping (101) and the second fluid piping (102) are parallel or quasi-parallel distributed in a plane structure or three-dimensional structure in the heat absorbing or dissipating body (100), and it is characterized by that the first fluid inlet (111) and the second fluid outlet (122) are installed at the location adjacent to the heat absorbing or dissipating body (100), while the first fluid outlet (112) and the second fluid inlet (121) are installed on another location adjacent to the heat absorbing or dissipating body (100) thereby the thermal conductive fluids (110) in two circuits inside the first fluid piping (101) and the second fluid piping (102) being installed on the heat absorbing or dissipating body (100) are respectively transported in reverse directions to commonly allow the whole temperature difference of the heat absorbing or dissipating body (100) more uniformly distributed for performing heat absorbing or dissipating function onto the passively heat dissipation or absorption receiving solid, or colloid, or liquid, or gaseous state article or space (200).
 2. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the first fluid piping (101) and the second fluid piping (102) are constituted by one or more than one relationships as following, including: (1) the heat absorbing or dissipating body (100) is in a assembled structure with at least one of the first fluid piping (101) and the second fluid piping (102); (2) the heat absorbing or dissipating body (100) is in an integral structure with at least one of the first fluid piping (101) and the second fluid piping (102); (3) the function of the heat absorbing or dissipating body (100) is directly provided by at least one of the first fluid piping (101) and the second fluid piping (102); (4) the first fluid piping (101) and/or the second fluid piping (102) is additionally installed with independent thermal conductive plate (300) which does not connect with the neighboring fluid piping; (5) common thermal conductive plate (400) connects between the neighboring fluid piping and the first fluid piping (101) and/or the second fluid piping (102); and (6) thermal conductive plate with temperature insulating slots connects between the neighboring fluid piping and the first fluid piping (101) and/or the second fluid piping (102).
 3. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the further constitutions include: First fluid piping (101), Second fluid piping (102): made of good thermal conductive material to constitute the common structural body for transferring thermal energy through the thermal conductive fluid (110) constituted by gaseous or liquid state liquid, gaseous to liquid state fluid, or liquid to gaseous state fluid to the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), wherein the first fluid piping (101) and the second fluid piping (102) are respectively constituted by one or more than one circuits; the first fluid inlet (111) of the first fluid piping (101) is parallel connected with the second fluid inlet (121) of the second fluid piping (102) to receive inflow of the thermal conductive fluid (110), and the first fluid outlet (112) of the first fluid piping (101) is parallel connected with the second fluid outlet (122) of the second fluid piping (102) to receive outflow of the thermal conductive fluid (110), while the first fluid piping (101) and the second fluid piping (102) the first fluid piping (101) and the second fluid piping (102) appear in parallel or quasi-parallel distributed in a plane structure or three-dimensional structure to constitute the common structural body, wherein it is characterized by that the first fluid inlet (111) of the first fluid piping (101) and the second fluid outlet (122) of the second fluid piping (102) are installed at the location adjacent to their common structural body, while the first fluid outlet (112) of the first fluid piping (101) and the second fluid inlet (121) of the second fluid piping (102) are installed on the another location adjacent to their common structural body, thereby for the first fluid piping (101) and the second fluid piping (102) in the multiple pipes of the common structural body to transport two circuits of the thermal conductive fluid flows (110) respectively in reverse directions thereby making the whole temperature difference of their common structural body more uniformly distributed in the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200) to perform heat absorption or dissipation onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).
 4. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 3, wherein the structural relationships between the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200), the first fluid piping (101) and the second fluid piping (102) include the following: the function of the heat absorbing or dissipating body (100) is directly provided by at least one of the first fluid piping (101) and the second fluid piping (102) to perform heat absorption or dissipation onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).
 5. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 3, wherein the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids further uses the first fluid piping and the second fluid piping that using multi-pipe to reversely transport thermal conductive fluids to directly constitute the common structural body and to directly transfer thermal energy onto the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).
 6. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids is further installed with the fluid inlets and the fluid outlets of the first fluid piping and the second fluid piping for reversely transporting thermal conductive fluids in temperature difference by multi-pipe at two sides of the piping, with same height or different height, respectively.
 7. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids is further installed with thermal conductive fluid passed and passively receiving heat absorbing or dissipating tubular structure body (100′), which is composed of one or more fluid piping or the structure similar the heat absorbing or dissipating body (100), in place of the passively heat dissipation or absorption receiving article in solid, or colloid, or liquid, or gaseous state or space (200).
 8. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein by the multiple pipes of the first fluid piping (101) and the second fluid piping (102), which are countercurrent to each other, being sequentially staggered for forming the heat absorbing or dissipating body (100), when the thermal conductive fluid (110) passes through the first fluid piping (101) with forward current and the second fluid piping (102) with reverse current, which are sequentially staggered, more uniform temperature distribution will be produced at two sides of the heat absorbing or dissipating body (100); the above first fluid piping (101) and/or second fluid piping (102) are straight pipes each with single segment or curved pipes each with at least one bending, and every bending segment of the first fluid piping (101) and the second fluid piping (102) are staggered in the order of mutual countercurrent.
 9. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the piping in the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids is additionally installed with an independent thermal conductive plate (300), and/or a common thermal conductive plate (400), and/or a thermal conductive plate (350) with temperature insulating slots to improve effects of heat absorption or dissipation.
 10. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 8, wherein more uniform temperature distribution is produced at two sides of the heat absorbing or dissipating body (100); for further improving effects of heat absorption or dissipation, the first fluid piping (101) and/or the second fluid piping (102) is additionally installed with the independent thermal conductive plate (300) to increase heat absorption or dissipation area to improve effects of heat absorption or dissipation.
 11. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the fluid passing through the first fluid piping (101) and/or the thermal conductive fluid passed and passively receiving heat absorbing or dissipating tubular structure body (100′) is controlled by control device (500) to drive two-way movement of fluid pumping device (600) for periodic forward/reverse pumping operation, to periodically forward/reverse pump the thermal conductive fluid (110), and to improve effects of uniform temperature; and the above two-way movement of fluid pumping device (600) is used for periodic forward/reverse pumping under the control of control device composed of electromechanical device, electronic device, or microcomputer and related software.
 12. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the first fluid piping (101) and the second fluid piping (102) are constituted by an integral type structure of the piping made directly using the structure of the heat absorbing or dissipating body (100).
 13. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the three of first fluid piping (101), second fluid piping (102) and heat absorbing or dissipating body (100) are constituted by an assembled structure.
 14. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the heat absorbing or dissipating body (100) for combination with the first fluid piping (101) and the second fluid piping (102) is constituted by the structural unit of the single structural body in plate, block, or multi-fins shape, or the structural unit assembled by fins, and is constituted by at least one structural unit.
 15. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the three of the heat absorbing or dissipating body (100) constituted by solid, or colloid, or liquid, or gaseous state thermal conductive material, the first fluid piping (101) and the second fluid piping (102) are partly or all made to various geometric shapes while without changing the principles.
 16. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the thermal conductive fluid (110) passing through the first fluid piping (101) and the second fluid piping (102) is transported by pumping, evaporation, or heat-cold natural circulation.
 17. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the warming or cooling energy is discharged to the liquid state passively heat dissipation or absorption receiving article or space (200) through using the cold-heat natural circulation of fluid in temperature difference or forced fluid pumping to generate thermal transfer function of heat convention, radiation or conduction; or the warming or cooling energy is discharged to the solid or colloidal or liquid or gaseous state passively heat dissipation or absorption receiving article or space (200) through conduction.
 18. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the thermal conductive fluid (110) passing through the first fluid piping (101) and the second fluid piping (102) is closed-loop circulated or open-loop released.
 19. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the fluid inlets and the fluid outlets of the various fluid piping are installed with same or different pointing direction within three-dimensional space.
 20. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein there are various installation modes of the fluid piping, including that the fluid piping is composed of tubular structure; and/or the fluid piping is composed of plate sheet structure for fluid flow; and/or the pore-like fluid piping is composed of blocky structure for fluid flow.
 21. The heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids as claimed in claim 1, wherein the heat absorbing or dissipating device with multi-pipe reversely transported temperature difference fluids is applied for various heat absorbing, or dissipating, or cooling heat conducting application devices, such as the cooling water radiators of the engine, heat absorbing cooling energy discharge device using thermal conductive fluid, or heat dissipating warming energy discharge device using thermal conductive fluid such as thermal energy, heater or thermal energy transfer devices for warming equipments, or heating or cooling for ceilings, walls or floors of the buildings, or cooling of photovoltaic panels, or heating or cooling for electrical machine or power machineries, or heat absorption and dissipation of various machine casings, heat pipe structures, structure casings, various chips or semiconductor components, ventilation devices, or the heat absorption, heat dissipation or thermal energy transfer of information, audio or image devices, or heat dissipation of various lamp or LED devices, or the heat absorption of the evaporator or heat dissipation or thermal energy transfer of condensers of air conditioning devices, or thermal energy transfer of mechanical devices, or heat dissipation of frictional heat loss, or heat dissipation or thermal energy transfer of electric heater or other electric heating home appliances or cooking devices, or heat absorption or thermal energy transfer of flame heating stoves or cooking devices, or heat absorption, heat dissipation or thermal energy transfer of earth layer or water thermal energy, plant or housing building or building material or building structure devices, heat absorbing or dissipation of water tower, or heat absorption, heat dissipation or thermal energy transfer of batteries of fuel cells; and for thermal energy transfer in home appliances, industrial products, electronic products, electrical machines or mechanical devices, power generation equipments, buildings, air conditioning devices, industrial equipments or industrial manufacturing process. 